Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC

assembly,Cable assembly,Mix technology assembly and Box-buildings.

Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;

BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.

Capabilities overview:

PCB Requirements

Communication devices require PCBs to provide robust and reliable connectivity solutions for complex high speed components. Signal integrity needs to be maintained as signals travel between transceivers, antennas, power amplifiers and more. These requirements generally include:

• High-Frequency Performance
  Many communication device signals operate at high frequencies in the microwave band. For example, smartphones incorporate multiband antennas that support 4G and 5G frequency bands – 700 MHz to 5 GHz for the latest generation. This requires PCB materials and construction to enable proper signal transmission without degradation through dielectric power loss or leaky RF conduction paths. We carefully select substrates and lamination materials tailored for high frequency operation based on dielectric constant, loss tangent, thermal conductivity, TCE and other parameters.
• High Speed Signal Handling
  In addition to frequency, data rate throughput capacity is equally important. Cutting-edge phones with multi-Gbps Wi-Fi 6 speeds, high bandwidth wireless interfaces need PCBs with fine line traces and spaces (4-6 mil line/space is common for data lines). Short signal paths routed close together require low loss, tight impedance tolerance laminates as well as careful stackups for characteristic impedance control. And a robust power distribution network is key for clean power delivery to signal ICs and FPGAs operating at high clock rates. We design layer counts, trace dimensions, dielectrics and laminate materials specifically to maintain signal integrity in high speed signal paths.
• EMI and Crosstalk Prevention
  With complex components in close proximity and interacting at high frequencies, communication PCBs must prevent unwanted coupling between traces. Short signal return paths, reference planes and proper component placement facilitate field confinement. Our engineers utilize careful stackup symmetry, selective isolation/shielding around sensitive components, ground stitching vias alongside traces, and special treatments to eliminate EMI emission and minimize crosstalk in dense layouts with high speed traces throughout multilayer boards.

Quality and Reliability

Delivering the highest reliability PCB solutions for mission-critical communication systems demands strict process and quality management upholding industry standards. As an ISO 9001 certified manufacturer, we’ve implemented robust infrastructure spanning materials qualification to volume fabrication monitoring:

• IPC Standards
  We benchmark quality against IPC J-STD-001, IPC-A-600 and other widely adopted PCB quality specifications. Audits of our facilities verify standard classes conformance through acceptance testing of fabricated boards as well as process reviews targeting continual improvement per IPC guidelines. IPC certifications validate disciplined, optimized fabrication workflows.
• Advanced Quality Planning
  Reliability risks are systematically identified during NPI through process controls selection, PFMEA/DRBFM and test vehicle measurements establishing performance baselines. We tailor process qualification, verification testing and QA sampling plans per customer requirements and design risk assessments. Each producible design has associated quality plan generating 1st pass yields.
• Traceability
  Raw materials receipt to finished boards shipped are tracked by ERP software tools with batch/lot traceability. Barcode work orders follow boards through process documenting each fabrication, inspection and test operation in our secured database. Complete traceability with records retention delivers the transparency customers expect from their trusted PCB producers.